OR

Upload

Upload BOM Upload extra

Solder

Home > Product > Soldering, Desoldering, Rework Products > Solder > 86-7033-0118

86-7033-0118

Price:

Series:

CHIPQUIK®

Product Status:

Active

Package:

Bulk

Type:

Solder Paste

Composition:

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter:

-

Melting Point:

423°F (217°C)

Flux Type:

Water Soluble

Wire Gauge:

-

Mesh Type:

4

Process:

Lead Free

Form:

Jar, 17.64 oz (500g)

Shelf Life:

6 Months

Shelf Life Start:

Date of Manufacture

Storage/Refrigeration Temperature:

-

Inquire Now Next Product

Related Products

Compaq Electronics Asia Limited

Tel.: +886-15986828728

Email: info@compaqelectronics.com

Add.: Room 504, Unit 2, Building 8, Huilongyuan, Minzhi Street, Longhua New District, Shenzhen

Navigation

UPLOAD B.O.M

Follow Us

Copyright © Compaq Electronics Asia Limited All Rights Reserved | Sitemap