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Home > Product > Soldering, Desoldering, Rework Products > Solder > SR37-LFM23S-3.5-0.5MM

SR37-LFM23S-3.5-0.5MM

Price:

Series:

CHIPQUIK®

Product Status:

Active

Package:

Bulk

Type:

Solder Paste

Composition:

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter:

-

Melting Point:

423°F (217°C)

Flux Type:

Water Soluble

Wire Gauge:

-

Mesh Type:

4

Process:

Lead Free

Form:

Jar, 17.64 oz (500g)

Shelf Life:

6 Months

Shelf Life Start:

Date of Manufacture

Storage/Refrigeration Temperature:

-

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