Socket Adapters

Socket Adapters

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Operating Temperature

Package / Case

Manufacturer

DEUTSCH Connectors / TE Connectivity

3M

Logical Systems

MikroElektronika

ADI (Analog Devices, Inc.)

Aries Electronics, Inc.

Series

*

-

647

Correct-A-Chipu00ae

Correct-A-Chipu00ae 350000

Correct-A-Chipu00ae 351000

Correct-A-Chipu00ae 35W000

Correct-A-Chipu00ae 505

Correct-A-Chipu00ae 650000

Correct-A-Chipu00ae 665000

Correct-A-Chipu00ae 666000

Textoolu2122

Correct-A-Chipu00ae 1106396

Correct-A-Chipu00ae 1107254

Correct-A-Chipu00ae 1109252

Correct-A-Chipu00ae 1109342

Correct-A-Chipu00ae 1109522

Correct-A-Chipu00ae 1109523

Correct-A-Chipu00ae 1110087

Correct-A-Chipu00ae 1110267-N

Correct-A-Chipu00ae 1111163

Correct-A-Chipu00ae 1111841

Correct-A-Chipu00ae 1111903

Correct-A-Chipu00ae 301296

Correct-A-Chipu00ae 301550

Correct-A-Chipu00ae 304235

Correct-A-Chipu00ae 304504

Correct-A-Chipu00ae 304538

Correct-A-Chipu00ae 304633

Correct-A-Chipu00ae 305263

Correct-A-Chipu00ae 305479

Correct-A-Chipu00ae 307349

Correct-A-Chipu00ae 352000

Correct-A-Chipu00ae 353000

Correct-A-Chipu00ae 354000

Correct-A-Chipu00ae 354W00

Correct-A-Chipu00ae 450001

Correct-A-Chipu00ae 555000

Correct-A-Chipu00ae 651000

Correct-A-Chipu00ae 652000

Correct-A-Chipu00ae 653000

Correct-A-Chipu00ae 655000

Correct-A-Chipu00ae 6645

Correct-A-Chipu00ae 68340

Correct-A-Chipu00ae 95-132I25

Correct-A-Chipu00ae 96-160M65

Correct-A-Chipu00ae 96-208M50

Correct-A-Chipu00ae 97-56001

Correct-A-Chipu00ae 97-68340

Correct-A-Chipu00ae 97-AQ132D

DS9075

Product Status

Active

Discontinued at Digi-Key

Obsolete

Quantity Available Price Series Product Status PackageConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material

-

Active

Bulk

TSOP

DIP

56

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

-

-

-

Active

Bulk

TSOP

DIP

40

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

-

-

-

Active

Bulk

SOIC

DIP

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

-

-

-

Active

Bulk

SOIC

DIP, 0.6" (15.24mm) Row Spacing

40

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

-

-

-

Obsolete

Bulk

AT90PWM2

DIP

40

-

-

-

-

-

-

-

-

-

Active

Bulk

AT90PWM1

DIP

40

-

-

-

-

-

-

-

-

Correct-A-Chipu00ae

Active

Tube

Multiple Packages

QFP

80

0.031" (0.80mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

Correct-A-Chipu00ae

Active

Tube

Multiple Packages

QFP

32

0.031" (0.80mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

Correct-A-Chipu00ae

Active

Tube

Multiple Packages

QFP

80

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

Correct-A-Chipu00ae

Active

Tube

Multiple Packages

QFP

52

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

Correct-A-Chipu00ae

Active

Tube

Multiple Packages

QFP

80

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

Correct-A-Chipu00ae

Active

Tube

Multiple Packages

QFP

60

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

Correct-A-Chipu00ae

Active

Tube

Multiple Packages

QFP

52

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

Correct-A-Chipu00ae

Active

Tube

Multiple Packages

QFP

40

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

Correct-A-Chipu00ae

Active

Tube

Multiple Packages

QFP

40

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

Polyester

FR4 Epoxy Glass

DS9075

Obsolete

Bulk

SIP

DIP

40

-

-

-

-

-

-

-

-

Correct-A-Chipu00ae 97-AQ132D

Discontinued at Digi-Key

Bulk

PQFP

PGA

132

0.025" (0.64mm)

Gold

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 97-AQ132D

Active

Bulk

PQFP

PGA

132

0.025" (0.64mm)

Gold

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

-

Active

Bulk

-

-

-

-

-

-

-

-

-

-

-

Correct-A-Chipu00ae 68340

Discontinued at Digi-Key

Bulk

QFP

PGA

144

0.026" (0.65mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 97-68340

Active

Bulk

QFP

PGA

144

0.026" (0.65mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 97-56001

Discontinued at Digi-Key

Bulk

QFP

PGA

169

0.025" (0.64mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 97-56001

Active

Bulk

QFP

PGA

169

0.025" (0.64mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 96-208M50

Active

Bulk

QFP

PGA

208

0.020" (0.50mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 96-160M65

Active

Bulk

QFP

PGA

160

0.026" (0.65mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae

Obsolete

-

QFP

PGA

128

0.031" (0.80mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

-

Obsolete

-

QFP

PGA

100

0.026" (0.65mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

-

Obsolete

-

QFP

PGA

80

0.031" (0.80mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 95-132I25

Discontinued at Digi-Key

Bulk

QFP

PGA

132

0.025" (0.64mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 95-132I25

Active

Bulk

QFP

PGA

132

0.025" (0.64mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

-

Obsolete

-

QFP

PGA

100

0.025" (0.64mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 653000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

84

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 653000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

84

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

84

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

84

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 505

Active

Bulk

PLCC

PGA

84

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 505

Discontinued at Digi-Key

Bulk

PLCC

PGA

84

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 505

Active

Bulk

PLCC

PGA

84

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

*

Active

Bag

-

-

-

-

-

-

-

-

-

-

-

*

Active

Bag

-

-

-

-

-

-

-

-

-

-

-

*

Active

Bag

-

-

-

-

-

-

-

-

-

-

-

*

Active

Bulk

-

-

-

-

-

-

-

-

-

-

-

*

Active

Bag

-

-

-

-

-

-

-

-

-

-

-

*

Active

Bag

-

-

-

-

-

-

-

-

-

-

-

-

Active

Bulk

HB2E Relay

DIP, 0.3" (7.62mm) Row Spacing

8

-

-

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 653000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

68

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 653000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

68

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

68

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

68

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 505

Discontinued at Digi-Key

Bulk

PLCC

PGA

68

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 505

Active

Bulk

PLCC

PGA

68

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 505

Discontinued at Digi-Key

Bulk

PLCC

PGA

68

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 304538

Active

Bulk

PLCC

PGA

68

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

-

Obsolete

-

TQFP

QFP

64

0.031" (0.80mm)

-

Through Hole

Solder

0.031" (0.80mm)

Tin-Lead

-

FR4 Epoxy Glass

-

Obsolete

-

QFP

PGA

184

-

-

-

-

-

-

-

-

Correct-A-Chipu00ae 505

Obsolete

Bulk

PLCC

PGA

52

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 6645

Active

Bulk

TQFP

DIP, 0.6" (15.24mm) Row Spacing

48

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 655000

Obsolete

Bulk

TSOP

DIP, 0.6" (15.24mm) Row Spacing

48

0.020" (0.50mm)

Silver

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 653000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 653000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

44

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

647

Active

Bulk

SOIC

DIP, 0.6" (15.24mm) Row Spacing

44

-

Gold

Through Hole

Solder

-

Tin

-

-

Correct-A-Chipu00ae 505

Active

Bulk

PLCC

PGA

44

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 505

Active

Bulk

PLCC

PGA

44

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 305263

Active

Bulk

QFP

PLCC

44

0.024" (0.60mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 651000

Active

Bulk

SSOP

DIP, 0.6" (15.24mm) Row Spacing

36

0.026" (0.65mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 655000

Discontinued at Digi-Key

Bulk

TSOP

DIP, 0.6" (15.24mm) Row Spacing

32

0.020" (0.50mm)

Silver

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 655000

Active

Bulk

TSOP

DIP, 0.6" (15.24mm) Row Spacing

32

0.020" (0.50mm)

Silver

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 653000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 653000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Discontinued at Digi-Key

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 650000

Active

Tube

SOJ

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 650000

Discontinued at Digi-Key

Tube

SOIC

DIP, 0.6" (15.24mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 450001

Active

Tube

SOJ

DIP, 0.4" (10.16mm) Row Spacing

32

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 450001

Discontinued at Digi-Key

Bulk

SOJ

DIP, 0.4" (10.16mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 450001

Active

Bulk

SOJ

DIP, 0.4" (10.16mm) Row Spacing

32

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

32

-

Gold

Surface Mount

Solder

0.100" (2.54mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.9" (22.86mm) Row Spacing

DIP, 0.9" (22.86mm) Row Spacing

90

0.070" (1.78mm)

Gold

Through Hole

Solder

0.070" (1.78mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.9" (22.86mm) Row Spacing

DIP, 0.9" (22.86mm) Row Spacing

90

0.070" (1.78mm)

Gold

Through Hole

Solder

0.070" (1.78mm)

Gold

Polysulfone (PSU), Glass Filled

-

Correct-A-Chipu00ae 665000

Active

Bulk

SOIC-W

SOIC

28

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 653000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 653000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 652000

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 651000

Obsolete

Tube

SSOP

DIP, 0.6" (15.24mm) Row Spacing

28

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 651000

Active

Bulk

SSOP

DIP, 0.6" (15.24mm) Row Spacing

28

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 650000

Discontinued at Digi-Key

Bulk

SOIC

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 650000

Discontinued at Digi-Key

Bulk

SOIC

DIP, 0.6" (15.24mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 555000

Active

Bulk

SSOP

SOWIC

28

0.026" (0.65mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 505

Active

Bulk

PLCC

PGA

28

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 505

Active

Bulk

PLCC

PGA

28

0.050" (1.27mm)

-

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 450001

Active

Bulk

SOJ

DIP, 0.4" (10.16mm) Row Spacing

28

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 450001

Active

Bulk

SOJ

DIP, 0.4" (10.16mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

-

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Active

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

28

-

-

Through Hole

Solder

0.050" (1.27mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

28

-

Gold

Surface Mount

Solder

0.100" (2.54mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

SOIC

28

-

Gold

Surface Mount

Solder

0.100" (2.54mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

28

-

Gold

Surface Mount

Solder

0.100" (2.54mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

28

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 353000

Active

Bulk

PLCC

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

Tin-Lead

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 352000

Active

Bulk

PLCC

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 350000

Discontinued at Digi-Key

Bulk

SOIC

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 350000

Active

Tube

SOIC

DIP, 0.3" (7.62mm) Row Spacing

28

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Textoolu2122

Active

Box

DIP, 0.9" (22.86mm) Row Spacing

DIP, 0.9" (22.86mm) Row Spacing

64

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.9" (22.86mm) Row Spacing

DIP, 0.9" (22.86mm) Row Spacing

64

0.070" (1.78mm)

Gold

Through Hole

Solder

0.070" (1.78mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.8" (20.32mm) Row Spacing

DIP, 0.8" (20.32mm) Row Spacing

64

0.070" (1.78mm)

Gold

Through Hole

Solder

0.070" (1.78mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Obsolete

Box

DIP, 0.8" (20.32mm) Row Spacing

DIP, 0.8" (20.32mm) Row Spacing

64

0.070" (1.78mm)

Gold

Through Hole

Solder

0.070" (1.78mm)

Gold

Polysulfone (PSU), Glass Filled

-

Correct-A-Chipu00ae 665000

Active

Bulk

SOIC-W

SOIC

26

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

48

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

48

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

48

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Obsolete

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

48

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

42

0.070" (1.78mm)

Gold

Through Hole

Solder

0.070" (1.78mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

42

0.070" (1.78mm)

Gold

Through Hole

Solder

0.070" (1.78mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Obsolete

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

42

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

42

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Obsolete

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

42

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

42

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 1.0" (25.40mm) Row Spacing

DIP, 1.0" (25.40mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 1.0" (25.40mm) Row Spacing

DIP, 1.0" (25.40mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Correct-A-Chipu00ae 666000

Active

Bulk

SOIC

SOWIC

24

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 665000

Active

Bulk

SOIC-W

SOIC

24

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 651000

Active

Bulk

SSOP

DIP, 0.6" (15.24mm) Row Spacing

24

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 650000

Discontinued at Digi-Key

Bulk

SOIC

DIP, 0.6" (15.24mm) Row Spacing

24

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 650000

Active

Tube

SOIC

DIP, 0.6" (15.24mm) Row Spacing

24

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 650000

Discontinued at Digi-Key

Bulk

SOIC

DIP, 0.6" (15.24mm) Row Spacing

24

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Active

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

24

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Active

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

24

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 354W00

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOWIC

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354W00

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

SOWIC

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

24

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

24

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

24

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

24

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 351000

Active

Bulk

SSOP

DIP, 0.3" (7.62mm) Row Spacing

24

0.026" (0.65mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 351000

Active

Bulk

SSOP

DIP, 0.3" (7.62mm) Row Spacing

24

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 350000

Active

Bulk

SOIC

DIP, 0.3" (7.62mm) Row Spacing

24

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

32

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

32

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

32

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Obsolete

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

32

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.4" (10.16mm) Row Spacing

DIP, 0.4" (10.16mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.4" (10.16mm) Row Spacing

DIP, 0.4" (10.16mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.4" (10.16mm) Row Spacing

DIP, 0.4" (10.16mm) Row Spacing

28

0.070" (1.78mm)

Gold

Through Hole

Solder

0.070" (1.78mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.4" (10.16mm) Row Spacing

DIP, 0.4" (10.16mm) Row Spacing

28

0.070" (1.78mm)

Gold

Through Hole

Solder

0.070" (1.78mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Obsolete

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Obsolete

Box

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.4" (10.16mm) Row Spacing

DIP, 0.4" (10.16mm) Row Spacing

22

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.4" (10.16mm) Row Spacing

DIP, 0.4" (10.16mm) Row Spacing

22

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

20

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

20

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Correct-A-Chipu00ae 666000

Active

Bulk

SOIC

SOWIC

22

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 665000

Active

Bulk

SOIC-W

SOIC

22

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 304504

Active

Bulk

SOIC

DIP, 0.4" (10.16mm) Row Spacing

22

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Textoolu2122

Active

Box

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

18

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

18

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

16

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Box

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

14

0.100" (2.54mm)

Gold

Through Hole

Wire Wrap

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Textoolu2122

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

14

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

Polysulfone (PSU), Glass Filled

-

Correct-A-Chipu00ae 666000

Active

Bulk

SOIC

SOWIC

20

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 665000

Active

Bulk

SOIC-W

SOIC

20

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 651000

Active

Bulk

SSOP

DIP, 0.6" (15.24mm) Row Spacing

20

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 555000

Active

Bulk

SSOP

SOWIC

20

0.026" (0.65mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Active

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 354W00

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOWIC

20

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354W00

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

SOWIC

20

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

20

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

20

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

20

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

20

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 353000

Active

Bulk

PLCC

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

Tin-Lead

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 352000

Active

Bulk

PLCC

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 351000

Active

Bulk

SSOP

DIP, 0.3" (7.62mm) Row Spacing

20

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 350000

Active

Tube

SOJ

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 350000

Active

Bulk

SOJ

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 350000

Active

Bulk

SOIC

DIP, 0.3" (7.62mm) Row Spacing

20

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

Correct-A-Chipu00ae 301550

Active

Bulk

SOIC

PLCC

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 301550

Active

Bulk

SOIC

PLCC

20

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 666000

Active

Bulk

SOIC

SOWIC

18

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 665000

Active

Bulk

SOIC-W

SOIC

18

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Active

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

18

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Discontinued at Digi-Key

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

18

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Active

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

18

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

18

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

18

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

18

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 351000

Active

Tube

SSOP

DIP, 0.3" (7.62mm) Row Spacing

18

0.026" (0.65mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 351000

Active

Bulk

SSOP

DIP, 0.3" (7.62mm) Row Spacing

18

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 350000

Active

Bulk

SOIC

DIP, 0.3" (7.62mm) Row Spacing

18

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

-

Active

Bulk

-

-

-

-

-

-

-

-

-

-

-

Correct-A-Chipu00ae 651000

Active

Bulk

SSOP

DIP, 0.6" (15.24mm) Row Spacing

16

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Discontinued at Digi-Key

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Active

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Active

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 354W00

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOWIC

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354W00

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

SOWIC

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

16

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

16

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

16

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

16

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 350000

Active

Bulk

SOIC

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

Correct-A-Chipu00ae 307349

Discontinued at Digi-Key

Bulk

PLCC

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 307349

Active

Bulk

PLCC

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 304633

Active

Bulk

PLCC

DIP, 0.3" (7.62mm) Row Spacing

16

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 304235

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

16

-

Gold

Through Hole

Solder

-

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

FR4 Epoxy Glass

Correct-A-Chipu00ae 666000

Active

Bulk

SOIC

SOWIC

14

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 665000

Active

Bulk

SOIC-W

SOIC

14

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 651000

Active

Bulk

SSOP

DIP, 0.6" (15.24mm) Row Spacing

14

0.026" (0.65mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Active

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

14

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Gold

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 35W000

Active

Bulk

SOIC-W

DIP, 0.3" (7.62mm) Row Spacing

14

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 354W00

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOWIC

14

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354W00

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

SOWIC

14

0.100" (2.54mm)

Gold

Through Hole

Solder

0.050" (1.27mm)

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

14

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

14

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

14

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

14

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 350000

Active

Bulk

SOIC

DIP, 0.3" (7.62mm) Row Spacing

14

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

Correct-A-Chipu00ae 666000

Active

Bulk

SOIC

SOWIC

12

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 665000

Active

Bulk

SOIC-W

SOIC

12

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 350000

Active

Bulk

SOIC

DIP, 0.3" (7.62mm) Row Spacing

12

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

Correct-A-Chipu00ae 1111903

Active

Bulk

SOWIC

DIP, 0.4" (10.16mm) Row Spacing

24

0.050" (1.27mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 1111841

Active

Bulk

MSOP

DIP, 0.3" (7.62mm) Row Spacing

8

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 1111841

Active

Bulk

MSOP

DIP, 0.3" (7.62mm) Row Spacing

-

0.020" (0.50mm)

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 1111163

Active

Bulk

Socket, 0.6" (15.24mm) Row Spacing

PLCC

40

-

Gold

-

-

-

-

Polyamide (PA46), Nylon 4/6, Glass Filled

FR4 Epoxy Glass

Correct-A-Chipu00ae 1110267-N

Active

Bulk

PLCC

DIP, 0.9" (22.86mm) Row Spacing

68

-

-

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 1110087

Active

Bulk

VQFP

PGA

144

0.020" (0.50mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 1109523

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

JEDEC

8

0.100" (2.54mm)

Gold

Through Hole

Solder

-

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

FR4 Epoxy Glass

Correct-A-Chipu00ae 1109522

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

JEDEC

8

0.100" (2.54mm)

Gold

Through Hole

Solder

-

Tin-Lead

Polyamide (PA46), Nylon 4/6, Glass Filled

FR4 Epoxy Glass

Correct-A-Chipu00ae 1109342

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

44

-

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

Polyphenylene Sulfide (PPS)

FR4 Epoxy Glass

Correct-A-Chipu00ae 1109252

Active

Bulk

PLCC

DIP, 0.6" (15.24mm) Row Spacing

28

-

-

Through Hole

Solder

0.070" (1.78mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 1107254

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1107254

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

36

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1107254

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

32

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1107254

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1107254

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1107254

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

20

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1107254

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

18

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1107254

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1107254

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

14

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1107254

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

DIP, 0.3" (7.62mm) Row Spacing

8

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1106396

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

40

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1106396

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

36

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1106396

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

32

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1106396

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

28

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1106396

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

24

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1106396

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

20

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1106396

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

16

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 1106396

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

DIP, 0.6" (15.24mm) Row Spacing

14

0.100" (2.54mm)

Gold

Through Hole

Solder

0.100" (2.54mm)

Tin

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 666000

Active

Bulk

SOIC

SOWIC

10

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 665000

Active

Bulk

SOIC-W

SOIC

10

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 350000

Active

Bulk

SOIC

DIP, 0.3" (7.62mm) Row Spacing

10

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

Correct-A-Chipu00ae 666000

Active

Bulk

SOIC

SOWIC

8

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 665000

Active

Bulk

SOIC-W

SOIC

8

0.050" (1.27mm)

-

Surface Mount

Solder

0.050" (1.27mm)

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

8

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

8

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 354000

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

SOIC

8

0.100" (2.54mm)

Gold

Surface Mount

Solder

0.050" (1.27mm)

Gold

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Correct-A-Chipu00ae 350000

Active

Bulk

SOIC

DIP, 0.3" (7.62mm) Row Spacing

8

0.050" (1.27mm)

Tin

Through Hole

Solder

0.100" (2.54mm)

Tin-Lead

-

Polyimide (PI)

Correct-A-Chipu00ae 305479

Active

Bulk

SOIC

JEDEC

8

0.050" (1.27mm)

-

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

Correct-A-Chipu00ae 301296

Active

Bulk

SOIC

JEDEC

8

0.050" (1.27mm)

-

Through Hole

Solder

-

Tin-Lead

-

FR4 Epoxy Glass

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