Whether you are an OEM or an independent distributor buying on the open market, undetected substandard and counterfeit parts pose one of the greatest risks to your business. Counterfeit electronic component detection, through quality and authenticity checks and testing, mitigates a wide range of risks posed by substandard parts, including excessive repurchase costs, delays in time-to-market, and damage to your company's reputation.

Compaq solves all worries for the majority of OEM/ODM/EMS customers. We perform a series of counterfeit component detection tests to ensure all components meet your quality standards, while identifying potential counterfeit products in the process.

Samples will be tested in accordance with J-STD-002D (Method: Hot Dip and Appearance) for evidence of porosity, voids, coverage, inconsistent wetting, etc. Solderability depends on the type of solder alloy in question - when using lead-free alloys, solderability is very different from when using lead-based alloys. Solderability testing includes through-hole, SMD and BGA packages.

X-ray analysis to verify that internal leadframes, bond wires and die structures are consistent within batches and, where possible, to known good devices. Chip size, general shape, lead frame structure, wire bond gauges and routing can be checked. In general, there should be no differences between parts of the same date and lot number. Keep radiographic film (or digital images) of each device. If any abnormality is found in the samples of the batch, 100% of the batch should be X-rayed.