Temperature, Humidity, Bias (THB) testing analyzes the effects of the environment on electronic components, such as mechanical, optical (fogging) or sealing failures, and failures due to parameter changes. It simulates 20 years of moisture intrusion to the device under test when operating at 85°C/85% RH for 1000 hours.

Highly Accelerated Stress Testing (HAST) evaluates the reliability of non-hermetic packaged solid-state devices in wet environments. It employs elevated temperature and humidity under pressure to accelerate moisture penetration through the outer package or along the interface between the package and the metal conductor passing through it. Under certain conditions, the HAST test can be used as an accelerated version of the traditional THB test.

Thermal shock testing analyzes the resistance of components to extreme temperatures, as well as the cyclic stress between these extremes. The Compaq features a 2-chamber system that moves product quickly between hot (+125°C to +150°C) and cold (-40°C to -55°C). temperature. Testing is generally performed in accordance with Test Method 1010 of MIL-STD-883.

The purpose of burn-in is to detect edge devices with inherent defects or manufacturing anomalies that lead to time- and stress-related failures. Without aging, these defective devices could lead to infant death or early life failure under normal conditions. Aging is performed at or above the maximum rated operating conditions, typically in accordance with Test Method 1015 of MIL-STD-883.